| 摘要 |
<P>PROBLEM TO BE SOLVED: To solve such problems that when a resin layer formed as a light reflecting part provided near an optical semiconductor element contains titanium oxide as white pigment in a substrate for mounting an optical semiconductor, (1) the processability decreases due to light shielding effect, (2) the resin curing property decreases due to photocatalyst reaction, and (3) the resin curing property decreases due to heat excited band gap type decomposition reaction. <P>SOLUTION: Filler 24 is used which contains as main component a substance with efficiently small absorbency in an ultraviolet region (below 400 nm) and efficiently small absorbency change in a visible light region (400-800 nm), having voids 25 inside and of which the index of refraction is 1.3-1.7 in place of titanium oxide. Processing with high precision and high reliability required for a light reflecting part provided near an optical semiconductor element on a substrate for mounting an optical semiconductor is achieved by processing with the photolithography technique a photosensitive thermosetting resin composition 23 in which such filler 24 is mixed. <P>COPYRIGHT: (C)2009,JPO&INPIT |
