| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an adhesive tape for TAB (Tape Automated Bonding) capable of reducing the occurrence of warpage of a TAB tape and suitably used for wire bonding. <P>SOLUTION: The adhesive tape for TAB is produced by forming an adhesive layer comprising a polyamide resin, an epoxy resin and a phenolic resin on an organic insulating film. The adhesive tape is characterized in that the elasticity modulus of the adhesive layer at 100°C is 200-500 MPa and the elasticity modulus thereof at 180°C is 10-100 MPa. <P>COPYRIGHT: (C)2009,JPO&INPIT |
