| 摘要 |
PROBLEM TO BE SOLVED: To provide a multi-layer printed circuit board for achieving minute circuit formation, and for manufacturing a thin board, and for preventing the bending of the substrate and a method for manufacturing this multi-layer printed circuit board. SOLUTION: This method for manufacturing a multi-layer printed circuit board includes: a step for successively forming a metal layer and a pattern for lower layer circuit formation in a carrier, and for forming a lower layer circuit by filling conductive substance in the pattern for lower layer circuit formation; a step for removing the pattern for lower layer circuit formation, and for laminating insulating resin, and for forming a via hole communicating with the lower layer circuit; a step for forming a pair of circuit parts by forming an internal circuit and an inter-layer connection part connecting the internal circuit to the lower layer circuit on the insulating resin; and a step for performing the position adjustment and mutual joint of the pair of circuit parts, and for removing the carrier and the metal layer. COPYRIGHT: (C)2009,JPO&INPIT |
