| 摘要 |
A semiconductor package apparatus comprises: at least one semiconductor chip; and a circuit board on which the semiconductor chip is installed, wherein at least one conductive plane for improving power and/or ground characteristics is positioned on a side of the semiconductor chip. In this manner, fabrication cost for the semiconductor package apparatus can be mitigated, and power and/or ground characteristics can be improved so as to readily control impedance of signal lines. As a result, reliability of the operation of the semiconductor package apparatus can be improved, and noise and malfunction can be prevented. |
