| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a solder bump forming method which can reduce a manufacturing cost and mount a conductive ball on each of multiple pads reliably. <P>SOLUTION: The solder bump forming method of carrying out a reflow treatment over the conductive balls 129 mounted on the respective multiple pads 107, thereby forming a solder bump, includes a metal film forming process of forming a metal film 151 capable of chemically reacting to a tackifying compound on the pads 107, an organic tacky layer forming process of causing a solution containing the tackifying compound to chemically react to the metal film 151, thereby forming an organic tacky layer 155 on the metal film 151, and a conductive ball mounting process of supplying the conductive balls 129 on the respective pads 107 having the organic tacky layer formed thereon, thereby mounting the conductive ball 129 on the respective pads 107 via the metal film 151. <P>COPYRIGHT: (C)2009,JPO&INPIT |
