| 摘要 |
PROBLEM TO BE SOLVED: To efficiently release heat generated in a semiconductor laser element. SOLUTION: The semiconductor laser element 10 and a sub-mount 11 are joined, the sub-mount 11 and a heat sink 12 are joined, a flange 14 is provided on the side face part of the heat sink 12, the heat sink 12 passes through the center hole of the flange 14 and projects to the lower surface side of the flange 14, and a part projecting to the flange lower surface side 14 is in contact with a Peltier element 220. Further, a laser drive substrate 100 is provided on a flange lower surface, a heat radiation member 200 is provided on the lower surface side of the laser drive substrate 100, a through-hole 102 is provided on the center of the laser drive substrate 100, heat transmission members 101 are provided on the upper surface part and lower surface part of the laser drive substrate 100, and conduction is performed through the through-hole 102. The heat transmission members 101 and the Peltier element 220 are in contact, also the heat transmission members 101 and the heat radiation member 200 are in contact, and the heat sink 12, the Peltier element 220, the through-hole 102 and the heat radiation members 220 are on the same axis and fixed. COPYRIGHT: (C)2009,JPO&INPIT
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