发明名称 MATERIAL FOR PRINTED CIRCUIT BOARD
摘要 PROBLEM TO BE SOLVED: To provide a material for printed circuit board with which a printed circuit board can be manufactured by a normal molding method such as compression molding without requiring an expensive device and without a hot coining method etc. which is low in productivity and with which a printed circuit board can be manufactured which can maintain strength, crystallinity, surface characteristics, electric characteristics, etc., of a conventional printed circuit board, has neither anisotropy nor unevenness in itself, and bears comparision with a conventional printed circuit board with respect to a size deformation amount at high temperature. SOLUTION: Disclosed is the material for printed circuit board containing crosslinking polytetrafluoroethylene having at least one kind of reactive functional group selected from a group of a cyano group (-CN), a first functional group expressed by a specified general formula, and a second functional group expressed by a specified general formula, or a polytetrafluoroethylene crosslinked body obtained by subjecting the crosslinking polytetrafluoroethylene to crosslinking reaction. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009044018(A) 申请公布日期 2009.02.26
申请号 JP20070208663 申请日期 2007.08.09
申请人 DAIKIN IND LTD 发明人 TANAKA ATSUKO;NANBA YOSHINORI;SAWADA MATAHIKO
分类号 H05K1/03;C08F214/26 主分类号 H05K1/03
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