| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor package having a hollow structure that prevents dew condensation in a hollow part, foreign matter intrusion into the hollow part, and corrosion in a metallic part such as an electrode by a simple structure. SOLUTION: A semiconductor package 1 is provided with at least a semiconductor substrate 10, a functional element 11 arranged on one side of the semiconductor substrate, a cap substrate 20 arranged in opposition to the one side of the semiconductor substrate at given intervals from the top surface of the semiconductor substrate, and a sealing member 21 arranged around the functional element for bonding the semiconductor substrate and the cap substrate, wherein the sealing member has at least a moisture permeable resin layer 22. COPYRIGHT: (C)2009,JPO&INPIT
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