| 摘要 |
PROBLEM TO BE SOLVED: To provide an inexpensive copper-plated flexible wiring board which is excellent in bending characteristic, and excellent as a circuit board having a flexed portion or a bent portion. SOLUTION: This flexible wiring board is a laminated flexible wiring board wherein a plurality of copper plating layers for wiring are formed on at least one surface of a resin film base via a seed layer, the copper plating layers composed of an electroplating layer and electroless plating layers, and a copper electroplating layer laminated in the uppermost surface. Preferably, the proportion of an electroless plating thickness in a total copper plating thickness (electroless copper plating thickness ratio) is 0.1-0.2, the thickness of the electroless copper plating layer is 0.5-2μm, and the thickness of the copper electroplating layer is 2-4μm. COPYRIGHT: (C)2009,JPO&INPIT
|
