发明名称 |
ADHESIVE FILM FOR SEMICONDUCTOR USE, METAL SHEET LAMINATED WITH ADHESIVE FILM, WIRING CIRCUIT LAMINATED WITH ADHESIVE FILM, AND SEMICONDUCTOR DEVICE USING SAME, AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE |
摘要 |
An adhesive film for semiconductor use of the present invention is used in a method in which, after the adhesive film for semiconductor use is laminated to one side of a metal sheet, the metal sheet is processed to give a wiring circuit, a semiconductor die is mounted and molded, and the adhesive film is then peeled off. The adhesive film includes a resin layer A formed on one side or both sides of a support film, the 90 degree peel strength between the resin layer A and the metal sheet prior to the processing of the metal sheet laminated with the adhesive film for semiconductor use to give the wiring circuit is 20 N/m or greater at 25° C., and the 90 degree peel strengths, after molding with a molding compound the wiring circuit laminated with the adhesive film for semiconductor use, between the resin layer A and the wiring circuit and between the resin layer A and the molding compound are both 1000 N/m or less at least one point in the temperature range of 0° C. to 250° C.
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申请公布号 |
US2009053498(A1) |
申请公布日期 |
2009.02.26 |
申请号 |
US20080255425 |
申请日期 |
2008.10.21 |
申请人 |
MATSUURA HIDEKAZU;KAWAI TOSHIYASU |
发明人 |
MATSUURA HIDEKAZU;KAWAI TOSHIYASU |
分类号 |
B32B7/12;B32B15/04;H01L21/56;H01L21/68;H01L23/31 |
主分类号 |
B32B7/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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