| 摘要 |
The invention is to provide a heat dissipating module structure for a heat generating device. The heat dissipating module structure according to a preferred embodiment of the invention includes a heat-conducting device, a carrier, and a heat-conducting material. The first end of the heat-conducting device is inserted into the bore such that the top of the first end of the heating-conducting device is aligned with or close to the upper surface of the carrier. The heat-conducting material surrounds the upper surface of the carrier such that the heat-conducting material together with the upper surface provides a supporting plane. The heat generating device is to be mounted on the supporting plane. Moreover, the heat generated from the heat generating device is conducted from the first end of the heat-conducting device to the second end of the heat-conducting device. |
