| 摘要 |
A chemical mechanical polishing device is provided to uniformly polish the semiconductor wafer by polishing the semiconductor wafer while the axis of rotation of the polishing head rotates the surrounding of shaft. A polishing head(210) is connected to a shaft and rotates around the axis of rotation. When the axis of rotation rotates the surrounding of shaft, the polishing head fixes a semiconductor wafer(500). A polishing pad(140) is arranged to be contacted with the surface of the semiconductor wafer. The first rotator of the polishing head is arranged on the head body and is connected to the shaft. The second rotator is arranged on the head body and inscribes with the outer circumference of the first rotator. The third rotator is arranged in the second rotator inner side. |
