ELECTRONIC PARTS PACKAGE, BASE FOR ELECTRONIC PARTS PACKAGE, AND JUNCTION STRUCTURE OF ELECTRONIC PARTS PACKAGE AND CIRCUIT SUBSTRATE

摘要

Provided is an electronic parts package including a base and a metal cover having a rectangular top plan shape, and terminal electrodes of the base bottom face and a circuit substrate are joined by a conductive junction material. In this electronic parts package, a first terminal electrode group having two or more terminal electrodes formed in parallel is formed at one offset angle position on the bottom face of the base, and a second terminal electrode group having one second terminal electrode and two or more terminal electrodes formed in parallel is offset only at a first diagonal position of the one angle position. In a grounding terminal electrode, electrodeless regions having no terminal electrode formed along the shorter side of the base are formed at the other angle position confronted in the shorter side direction of the base by the one angle position and at a second diagonal position of the other angle position, and at least one terminal electrode is connected with the metal cover.