SEMICONDUCTOR CHIP STACK TYPE PACKAGE AND METHOD OF FABRICATING THE SAME

摘要

A semiconductor chip stacking package and a manufacturing method thereof are provided to enough secure the wire bonding space by including the wiring board for electrically connecting bonding wires with the semiconductor chip group. A lead frame comprises a die paddle part(120p) and a lead portion(120liter). The first semiconductor chip group(I) and the second semiconductor chip group(II) are successively laminated on one side of the die paddle part. A wiring board(130u) is interposed between the first semiconductor chip group and the second semiconductor chip group. Bonding wires(125uc,125ud) for the second semiconductor chip electrically connect the second semiconductor chip group and the wiring board. The end part of the wiring board is electrically connected to the inner lead of the lead portion which is adjacent to the die paddle part. The adhesive member is provided between the end part of the wiring board and the inner lead of the lead portion.