发明名称 PRINTED CIRCUIT BOARD AND FABRICATING METHOD THEREOF
摘要 A printed circuit board and manufacturing method thereof are provided to simplify the structure and the process of the printed circuit board. The method for manufacturing the printed circuit board is as follows. The circuit pattern is printed on the upper side of the material(210). The insulating layer is formed on the material upper side having the circuit pattern with plasticity(220). The via hole passing through the upper side and the lower side faced in the upper side is formed in the insulating layer(230). The circuit pattern is printed on the insulating layer(240). The cover layers formed on the insulating layer in which the circuit pattern is formed(250).
申请公布号 KR20090020266(A) 申请公布日期 2009.02.26
申请号 KR20070084888 申请日期 2007.08.23
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 KIM, KI HYUN;KANG, SEOK MYONG;PARK, SE HO;LEE, YOUNG MIN;KIM, SANG HYUN
分类号 H05K3/10 主分类号 H05K3/10
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