发明名称 PROBE CARD
摘要 PROBLEM TO BE SOLVED: To provide a probe card capable of easily mounting/dismounting a contact probe on/from a probe substrate. SOLUTION: A resistance domain 30 is formed on the probe substrate 11, and an insulating layer 31 is formed on the resistance domain 30, and a probe mounting pad 32 is formed on the insulating layer 31. Further, a low melting-point metal layer 33 melted by Joule heat of the resistance domain 30 is formed on the probe mounting pad 32, and the contact probe 15 is fixed on the probe mounting pad 32 by the low melting-point metal layer 33. Hereby, when a heating current is supplied to the resistance domain 31 from the outside, the low melting-point metal layer 33 is melted, and mounting/dismounting of the contact probe 15 on/from the probe substrate 11 can be performed easily. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009042012(A) 申请公布日期 2009.02.26
申请号 JP20070206061 申请日期 2007.08.08
申请人 JAPAN ELECTRONIC MATERIALS CORP 发明人 HANESAKA MASATOSHI
分类号 G01R1/073;G01R31/26;H01L21/66 主分类号 G01R1/073
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