发明名称 Sheet for Forming a Protective Film for Chips
摘要 Described is a sheet for forming a protective film, which can be used suitably in a process where marking is made on the protective film formed on work such as a wafer and the like. The sheet includes a release sheet and a protective film forming layer provided on the release surface of the release sheet, wherein the protective film forming layer includes 100 parts by weight of an epoxy resin, 50 to 200 parts by weight of a binder polymer, and 100 to 2,000 parts by weight of fillers, 30% by weight or more of total 100% by weight of the said epoxy resin being selected from epoxy resins represented by the following formulae (I) and (II); wherein, X's are -O-, -OCH(CH3)O- and the like; R's are a polyether skeleton and the like; and n's are in the range of 1 to 10.
申请公布号 US2009053518(A1) 申请公布日期 2009.02.26
申请号 US20070294389 申请日期 2007.03.23
申请人 LINTEC CORPORATION 发明人 SAIKI NAOYA;SHINODA TOMONORI;YAMAZAKI OSAMU
分类号 B32B33/00 主分类号 B32B33/00
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