发明名称 |
Semiconductor wafers and methods of fabricating semiconductor devices |
摘要 |
A semiconductor wafer includes a plurality of unitary semiconductor chips formed on a semiconductor substrate. Scribe lane region separate the unitary semiconductor chips from each other. Test element group (TEG) pads are configured to apply testing signals for testing respective test elements. A TEG pad is arranged such that an acute angle formed at an intersection of a line extending from portion of a perimeter of the TEG pad and at least a portion of the outer edge of a corresponding scribe lane region is greater than 0° and less than or equal to 60°.
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申请公布号 |
US2009050885(A1) |
申请公布日期 |
2009.02.26 |
申请号 |
US20080222350 |
申请日期 |
2008.08.07 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
CHO YUN-RAE;LEE YOUNG-MIN;KWAK MIN-KEUN;KIM SHIN |
分类号 |
H01L23/58;H01L21/66 |
主分类号 |
H01L23/58 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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