| 摘要 |
The present invention discloses a flat panel based light emitting diode (LED) package structure. The package structure comprises a substrate, a plurality of first LED chips, a plurality of second LED chips and a protective layer. The first LED chips and the second LED chips are located on the substrate, and the second LED chips surround the first LED chips. The protective layer is for covering the first LED chips and the second LED chips. The protective layer has a first sub-structure and a plurality of second sub-structures, wherein the first sub-structure corresponds to the first LED chips, and the second sub-structures correspond to the plurality of second LED chips.
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