发明名称 RESIN COMPOSITION
摘要 The invention relates to a thermosetting resin composition comprising (A) 20 to 90 mass % of thermosetting resin, (B) 10 to 80 mass % of inorganic and/or organic fine particles and (C) 0.1 to 5 mass % of fluorine-containing polyether, wherein (C) is polymer having fluorinated alkyl polyoxetane structure of formula (1) or (2), (m is an integer of 1 to 100, n is an integer of 1 to 6, R1 represents a hydrogen atom or an alkyl group having 1 to 6 carbon atoms, R2 and R3 each represent a straight or branched chain alkyl group having 1 to 20 carbon atoms, with a proviso that at least 50% of hydrogen atoms present in the alkyl group is substituted by fluorine and the other hydrogen atoms are substituted by hydrogen, iodine, chlorine or bromine atoms) or a composition containing copolymer which consists of monomer having fluorinated alkyl polyoxetane structure and oxygen-containing monomer having 2 to 6 carbon atoms.
申请公布号 US2009054577(A1) 申请公布日期 2009.02.26
申请号 US20070279435 申请日期 2007.03.16
申请人 SHOWA DENKO K.K. 发明人 UCHIDA HIROSHI;INOUE HIROFUMI
分类号 C08L71/00;C08K3/22;C08K3/26;C08K3/30;C08K3/34;C08L61/00;C08L63/00;C08L67/00;C08L77/00;C08L83/00;C09D11/00 主分类号 C08L71/00
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