| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide an inductor element formed on a semiconductor substrate, which is applicable in particular to a high-frequency module or a voltage conversion module used for a portable information communication device, wireless LAN (local area network), or the like, can be miniaturized and suppress an increase in resistance loss, and to provide a manufacturing method thereof. <P>SOLUTION: The inductor element 20 formed on the semiconductor substrate 11 is provided with: an inductor body 61 penetrating through the semiconductor substrate 11, spirally formed and having conductivity; and an insulating film 12 provided between the side surface of the inductor body 61 and the semiconductor substrate 11. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
