| 摘要 |
A board-shaped thermal conductor base board ( 3 ) is arranged on the bottom surface of a power module ( 1 ). Substrates ( 4 ) and ( 5 ) are arranged on the top surface of the thermal conductor base board ( 3 ), and semiconductor elements ( 6 ) and ( 7 ) are respectively arranged on the top surfaces of the substrates ( 4 ) and ( 5 ). The semiconductor elements ( 6, 7 ) are surrounded by a resinous case ( 2 ). A source electrode ( 13 ) is attached above and apart from the semiconductor elements ( 6, 7 ) by using the resinous case ( 2 ). The connection between the source electrode ( 13 ) and the sources of the semiconductor elements ( 7 ) are connected by wire bonding. |
