发明名称 JET SOLDER BATH
摘要 PROBLEM TO BE SOLVED: To solve the following problems: although there are an impeller pump and a screw pump available as a jet pump to be installed in a jet solder bath, the impeller pump is more likely to generate a pulsation; and the screw pump can not have a jet height made sufficiently high. SOLUTION: The jet solder bath is provided with many partitions on an internal wall of a casing housing the screw pump. The partitions allow annular chambers formed of the partitions to stop fused solder from flowing backward even if the fused solder exiting from the screw pump is about to flow backward between the screw pump and the internal wall of the casing. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009043774(A) 申请公布日期 2009.02.26
申请号 JP20070204255 申请日期 2007.08.06
申请人 SENJU METAL IND CO LTD 发明人 NAKAMURA HIDEKI;SUGIHARA TAKASHI
分类号 H05K3/34;B23K1/08;B23K101/42 主分类号 H05K3/34
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