| 摘要 |
PROBLEM TO BE SOLVED: To provide a thermosetting resin composition which excels in a dielectric constant and storage stability and has adhesion to an electrically conductive layer. SOLUTION: The thermosetting resin composition comprises an epoxy resin, a curing agent, a curing accelerator, and an organic solvent, wherein: the curing agent comprises an active ester type curing agent and the content of the active ester type curing agent is 50-200 pts.wt. based on 100 pts.wt. epoxy resin; the curing accelerator comprises an imidazole compound and a phosphorus compound; and the content of the curing accelerator is 0.8-10 pts.wt. based on 100 pts.wt. the active ester type curing agent. COPYRIGHT: (C)2009,JPO&INPIT |
