| 发明名称 |
FLIP-CHIP TYPE SEMICONDUCTOR DEVICE |
| 摘要 |
A flip-chip type semiconductor device includes a semiconductor substrate. A plurality of electrode terminals are provided and arranged on a top surface of the semiconductor substrate, a sealing resin layer is formed on the top surface of the semiconductor substrate such that the electrode terminals are completely covered with the sealing resin layer.
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| 申请公布号 |
US2009051029(A1) |
申请公布日期 |
2009.02.26 |
| 申请号 |
US20080257689 |
申请日期 |
2008.10.24 |
| 申请人 |
NEC ELECTRONICS CORPORATION |
发明人 |
KURITA YOICHIRO;OUCHI RIEKA;MIYAZAKI TAKASHI;YAMADA TOSHIYUKI |
| 分类号 |
H01L23/488;H01L25/18;H01L21/56;H01L21/58;H01L21/60;H01L21/98;H01L23/28;H01L23/48;H01L23/50;H01L25/065;H01L25/07 |
主分类号 |
H01L23/488 |
| 代理机构 |
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