发明名称 |
Semiconductor device, substrate and semiconductor device manufacturing method |
摘要 |
The semiconductor device can prevent damages on a semiconductor chip even when a soldering material is used for bonding the back surface of the semiconductor chip to the junction plane of a chip junction portion such as an island or a die pad. This semiconductor device includes a semiconductor chip and a chip junction portion having a junction plane that is bonded to the back surface of the semiconductor chip with a soldering material. The junction plane is smaller in size than the back surface of the semiconductor chip. This semiconductor device may further include a plurality of extending portions which extend respectively from the periphery of the junction plane to directions parallel with the junction plane.
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申请公布号 |
US2009051049(A1) |
申请公布日期 |
2009.02.26 |
申请号 |
US20060887103 |
申请日期 |
2006.06.01 |
申请人 |
ROHM CO., LTD. |
发明人 |
KASUYA YASUMASA;HAGA MOTOHARU;MATSUBARA HIROAKI |
分类号 |
H01L21/50;H01L23/488 |
主分类号 |
H01L21/50 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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