HEAT EXHAUST EQUIPMENT OF PLATEN COVER IN WAFER POLISHING DEVICE

摘要

Heat exhaust equipment of platen cover in a wafer polishing device is provided to lower the surface temperature of the polishing pad by discharging the heat due to the rubbing of the polishing pad. A platen shield cover(50) blocks that the slurry runs away to the outside of platen in the polishing work. The heat exhaust part is formed in the platen shield cover and exhausts the frictional heat of the polishing pad to outside in the polishing work. The heat exhaust part includes a plurality of holes(52) which are formed on the top of the platen shield cover; a plurality of hole caps(54) capable of preventing that the slurry and DIW are splashed through the plurality of holes.