| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a heat radiation structure for cooling a solid state imaging element by reducing an external load applied on the solid state imaging element with a relatively simple structure, along with a solid state image pickup device having the heat radiation structure, relating to a heat radiation structure of the solid state image pickup element used for an imaging apparatus comprising the solid state image pickup element as well as a solid state imaging device having the heat radiation structure. <P>SOLUTION: The solid state image pickup element includes a heat radiation member which comprises first and second contact parts that are separately fixed to a plurality of prism members and separately contacted to first and second solid state image pickup elements adjoining each other, and a heat radiation part which radiates the heat transmitted through the first and second contact parts into the surrounding air. The heat radiation part is arranged between the first and second contact parts. The heat radiation member is formed from a series of foil member of which respective contact part and heat radiation part are made from high heat conductivity material. The heat radiation part has such shape as a foil member is bent or deflected by a plurality of times. <P>COPYRIGHT: (C)2009,JPO&INPIT |
