发明名称 |
METHOD FOR FORMING HOLES IN MAKING PRINTED CIRCUIT BOARD |
摘要 |
A method for forming holes in making a printed circuit board includes the step of: providing a copper clad laminate including an insulation layer and a copper layer laminated on the insulation layer; forming a carbon nano-material on the copper layer of the copper clad laminate; and applying a laser beam onto a portion of the carbon nano-material to define a hole in the copper clad laminate beneath the portion of the carbon nano-material.
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申请公布号 |
US2009050602(A1) |
申请公布日期 |
2009.02.26 |
申请号 |
US20080135843 |
申请日期 |
2008.06.09 |
申请人 |
TSINGHUA UNIVERSITY;HON HAI PRECISION INDUSTRY CO., LTD. |
发明人 |
LIN CHENG-HSIEN;LEE WEN-CHIN;JIANG KAI-LI |
分类号 |
H01B13/00 |
主分类号 |
H01B13/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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