| 摘要 |
A method of fabricating an inductor in a semiconductor device is disclosed. Embodiments include forming a first metal wire in a trench formed by etching a layer of a semiconductor substrate, forming an insulating layer over the substrate including the first metal wire, forming a via hole by etching the insulating layer to expose a portion of the first metal wire, forming a plated layer by electroplating to partially fill the via hole with the plated layer, and forming a second metal wire over the insulating layer including the plated layer.
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