| 发明名称 |
FAN OUT TYPE WAFER LEVEL PACKAGE STRUCTURE AND METHOD OF THE SAME |
| 摘要 |
To pick and place standard dies on a new base for obtaining an appropriate and wider distance between dies than the original distance of dies on a wafer. The package structure has a larger size of balls array than the size of the die by fan out type package. Moreover, the die may be packaged with passive components or other dies with a side by side structure or a stacking structure.
|
| 申请公布号 |
US2009051025(A1) |
申请公布日期 |
2009.02.26 |
| 申请号 |
US20080255868 |
申请日期 |
2008.10.22 |
| 申请人 |
ADVANCED CHIP ENGINEERING TECHNOLOGY INC. |
发明人 |
YANG WEN-KUN;YANG WEN-PIN;CHEN SHIH-LI |
| 分类号 |
H01L23/12;H01L23/48;H01L21/44;H01L21/48;H01L21/50;H01L21/58;H01L21/60;H01L23/00;H01L23/14;H01L23/31;H01L23/485;H01L23/52;H01L23/522;H01L23/538;H01L23/552;H01L25/065 |
主分类号 |
H01L23/12 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
|
| 地址 |
|
