| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a surface-mount LED which allows obviating detachment at the surface of an LED chip. <P>SOLUTION: In circuit patterns 11, 12 on a substrate 10, there are provided thick film portions 15 which are 1.6 times or above thicker than a thicker one of a device mounting region 22 and a wire connecting region 21. This arrangement, when heated, allows causing an interfacial detachment 25 at an interface between any of the thick film portions 15 and a sealing resin 16 sooner than an interface between a light-emitting device 13 and the sealing resin 16, whereby it is feasible to obviate an interfacial detachment between the light-emitting device 13 and the sealing resin 16. <P>COPYRIGHT: (C)2009,JPO&INPIT |
