| 摘要 |
PROBLEM TO BE SOLVED: To solve the problem that, since a conventional high-temperature circuit module is composed using a ceramic board 3, it is difficult to process the conventional high-temperature circuit module, and thus, the conventional high-temperature circuit module may be broken. SOLUTION: A lead frame 14 capable of coping with a high current is fixed to a metal plate 17 via a sheet-shaped heat-conductive resin layer 15 so as to be used as an insulating heatsink 13. The metal plate is strong and hard to be broken and can be subjected to folding processing or the like. A high-temperature semiconductor 11 such as SiC is a bare chip mounted to the insulating heatsink. Accordingly, it becomes possible to form a high-temperature circuit module 18 that can operate in an operation temperature range exceeding≥130°C where a silicon-based semiconductor cannot cope with, and thereby a vehicle engine or the like can electronically be controlled with high accuracy. Consequently, there is provided the high-temperature circuit module 18 that can improve fuel consumption or the like. COPYRIGHT: (C)2009,JPO&INPIT |
