发明名称 |
WIREBOND PAD FOR SEMICONDUCTOR CHIP OR WAFER |
摘要 |
In the present invention, copper interconnection with metal caps is extended to the post-passivation interconnection process. Metal caps may be aluminum. A gold pad may be formed on the metal caps to allow wire bonding and testing applications. Various post-passivation passive components may be formed on the integrated circuit and connected via the metal caps.
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申请公布号 |
US2009053887(A1) |
申请公布日期 |
2009.02.26 |
申请号 |
US20070756621 |
申请日期 |
2007.05.31 |
申请人 |
MEGICA CORPORATION |
发明人 |
LIN MOU-SHIUNG;CHEN MICHAEL;CHOU CHIEN-KANG;CHOU MARK |
分类号 |
H01L21/44;H01L23/485;H01L23/522;H01L23/532 |
主分类号 |
H01L21/44 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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