| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a wiring substrate with a built-in capacitor which can increase reliability by preventing peel-off between a capacitor and a resin interlayer insulating layer and preventing the displacement of the capacitor, and its manufacturing method. <P>SOLUTION: In the method of manufacturing a wiring substrate manufactured through a mounting process, a curing process, and a built-in process, a capacitor 10 is mounted on a resin interlayer insulating layer 81 in an uncured state and a portion of the resin interlayer insulating layer 81 is allowed to get in a through-hole 111, in the mounting process. The resin interlayer insulating layer 81 in the uncured state is cured so that the resin interlayer insulating layer 81 is in a cured state, in the curing process. The capacitor 10 is embedded in the resin interlayer insulating layer 81 by covering the capacitor 10 and the resin interlayer insulating layer 81 in the cured state with the upper layer side resin interlayer insulating layer, in the built-in process. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
