| 摘要 |
PROBLEM TO BE SOLVED: To provide a back side grinder performing both a chamfererd operation on a back side edge portion of a semiconductor substrate and a plane grinding operation on the back side thereof without increasing a footprint of such grinder. SOLUTION: By using a back side grinder 1 provided with a grinding tool spindle disposed above a substrate holder table such that such a spindle goes up and down, linearly moving a slide way S<SB>b</SB>on which the substrate holder table H is mounted above a linear guide way G<SB>b</SB>, and moving the substrate holder table to an edge grinding stage S<SB>e</SB>position, an edge grinding operation is performed. By linearly moving the substrate holder table H below the grinding tool spindle so as to move the substrate holder table position to a back side grinding stage S<SB>bg</SB>, a back side grinding operation is performed. COPYRIGHT: (C)2009,JPO&INPIT
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