发明名称 Method of Fabricating an Integrated Circuit
摘要 A method of fabricating an integrated circuit, including the steps of forming a first mask layer in the form of a hard mask layer including a plurality of first openings and a second mask layer with at least one second opening which at least partially overlaps with one of the first openings, wherein the at least one second opening is generated lithographically; and at least two neighboring first openings are distanced from each other with a center to center pitch smaller than the resolution limit of the lithography used for generating the second opening.
申请公布号 US2009053892(A1) 申请公布日期 2009.02.26
申请号 US20070843052 申请日期 2007.08.22
申请人 MEYER STEFFEN;WEIS ROLF;LUDWIG BURKHARD;NOELSCHER CHRISTOPH 发明人 MEYER STEFFEN;WEIS ROLF;LUDWIG BURKHARD;NOELSCHER CHRISTOPH
分类号 H01L21/44 主分类号 H01L21/44
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