发明名称 SUBSTRATE GRINDING APPARATUS
摘要 A substrate polishing article is provided to shorten the by consecutively and horizontally transferring the new substrate with a conveyor belt. A substrate polishing article comprises the transfer means(10,11,12,13) moving the substrate(S); the polishing part including the grinding wheel and the spindle; and the support tables (20a,20b) which while substrate is moved and the edge surface is ground, regularly maintain the height of the edge surface. The transfer means is conveyor in the state where the conveyor vacuum-sucking the substrate which is moved. The support table includes the blower spraying the air to substrate and the absorbing body inhaling the air from the substrate furnace.
申请公布号 KR20090019053(A) 申请公布日期 2009.02.25
申请号 KR20070083186 申请日期 2007.08.20
申请人 KNJ CO., LTD. 发明人 BAE, GI HWAN
分类号 B24B9/10 主分类号 B24B9/10
代理机构 代理人
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