Production method of electronic apparatus, production method of electronic equipment in which electronic apparatus is packaged, and production method of article in which electronic apparatus is mounted

摘要

A production method of an electronic apparatus includes: a step of making a thermosetting adhesive (13p) adhere to a face of a base where an antenna pattern (112) is formed on a film made (111) of a resin material, the face being a face which the antenna pattern is formed on; a step of mounting a circuit chip (12) connected to the antenna pattern, on the base through the thermosetting adhesive; a preheating step of heating the thermosetting adhesive on a first heating condition by which the thermosetting adhesive becomes a first cured state; and a main heating step of fixing the circuit chip to the antenna pattern by heating and curing the thermosetting adhesive on a second heating condition by which the thermosetting adhesive becomes a second cured state harder than the first cured state, with the base being clamped and pressurized from both of the circuit chip side and the film side.