DIE BONDER AND METHOD FOR DIE BONDING USING THE SAME

摘要

A die bonder and method for die bonding using the same is provided to control the support surface of the bonding head and board supporting surface of the bonding stage tight rapidly and accurately without a measurement procedure or the control process. In a die bonder and method for die bonding using the same, a reference surface supports one of a die(3) and a substrate(1). The counter surface supports the other one of the die and the substrate. A first plane adjusting device(100) contacts the counter surface in the reference surface and controls the slope of the reference surface accruing to the slope of the counter surface. The second plane adjust device(200) independently controls one slope of the reference surface and the counter surface. The bonding head(30) has the die support surface, and the bonding stage(40) has the board supporting surface(41) which supports the substrate when compressing die to the substrate. The first plane adjust device controls the slope of the die support surface, and the second plane adjust device controls the slope of the board supporting surface.