| 摘要 |
A semiconductor package is provided to secure a sufficient area for forming input/output terminals by forming a rewiring pattern in the individual semiconductor chips. A semiconductor package(100) includes a semiconductor chip module(15) and a rewiring(30). The semiconductor chip module includes at least two semiconductor chips(1,2). The semiconductor chips are integrated. Each semiconductor chip includes bonding pads(3,4,5,6). The rewiring includes pads(31,32,33) and connection units(34,35,36). The pad units are arranged on the semiconductor chip module. The connection units electrically connect the pad units and the bonding pads. The semiconductor chips are arranged in m x n matrix. The m is the natural number more than 1. The n is the natural number more than 2. The semiconductor chip module includes a first insulating layer pattern and a second insulating layer pattern. The openings of the first insulating layer patterns expose the bonding pads. The openings of the second insulating layer patterns expose the pad unit.
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