| 摘要 |
Systems and methods for scribing a semiconductor wafer (410) with reduced or no damage or debris to or on individual integrated circuits caused by the scribing process. The semiconductor wafer (410) is scribed from a back side (430) thereof. In one embodiment, the back side (430) of the wafer (410) is scribed following a back side grinding process but prior to removal of back side grinding tape (426). Thus, debris generated from the scribing process is prevented from being deposited on a top surface (412) of the wafer (410). To determine the location of dicing lanes or streets (424) relative to the back side (430) of the wafer (410), the top (412) side of the wafer (410) is illuminated with a light (434) configured to pass through the grinding tape (426) and the wafer (410). The light (434) is detected from the back side (430) of the wafer (410), and the streets are mapped relative to the back side (430). The back side (430) of the wafer (410) is then cut with a saw (444) or laser. |
