ALKALI DEVELOPABLE PHOTOSENSITIVE RESIN COMPOSITION AND DRY FILM MANUFACTURED BY THE SAME

摘要

A photoresist resin composition, a dry film prepared by using the composition, and a multilayered print wiring board prepared by using the dry film are provided to improve resolution and to allow it to be developed with an alkali aqueous solution. A photoresist resin composition comprises a poly(amic acid) represented by the formula 1; at least two kinds of (meth)acrylate compounds containing at least one C-C double bond; a photopolymerization initiator; a phosphorus-based flame retardant; and an organic solvent, wherein X1 is a tetravalent organic group containing an aromatic ring structure; and X2 is a divalent organic group containing an aromatic ring structure.