LIGHT EMITTING DIODE PACKAGE BY CHIP ON BOARD

摘要

A light emitting diode package is provided to reduce a manufacturing cost by forming silicon conductive material instead of AU or Ag electric pad. In a light emitting diode package, one conductive structure(120) is formed on the printed circuit board(110). One is selected from the silicone structure or the aluminum structure for the conductive structure. A LED chip(130) is mounted on the printed circuit board. The LED chip is electrically connected through the conductive structure to the printed circuit board. The thickness the conducting structure is hundreds um. The LED chip is capable of being connected to the conductive structure through the wire bonding.