MOLDING MATERIAL SUPPLYING TUBE FOR SEMICONDUCTOR DEVICE

摘要

A molding material supplying tube for semiconductor device is provided to supply uniform distribution of molding by making the speed of molding material passing through the guide portion reduced so that molding material is gathered at the center. A molding material supplying tube includes a guide unit and an exhausting unit(200) in which the hole(210) ejects the resin powder(PP). A spread nozzle is connected to the top of guide, and the exhausting unit is connected to the bottom of it. A plurality of rectifying plates(110) consisting of the panel member is installed at the inner side of the guide portion. A plurality of rectifying plates is composed of the three first rectifying plates(110a) and three second rectifying plates.