发明名称 METHOD AND APPARATUS OF CLEANING A TRAY
摘要 A method and an apparatus for removing the epoxy molding compound remaining in a tray are provided to prevent reattachment of the epoxy molding compound by vacuum-inhaling the epoxy molding compound removed by the air. A tray cleaning device(100) includes a body part(300), an air sprayer(400) and at least two vacuum suction parts(500). A tray(200) supplies the powdered epoxy molding compound. The body part is arranged in an upper part of the tray. The body part has a size corresponding to a first width of the tray. The body part moves to a direction of a second width vertical to the first width in the upper part of the tray. The air sprayer is formed in the center of the body part. The air sprayer is cut to the direction of the first width. The air sprayer sprays the air downward through the bottom of the body part. The epoxy molding compound remaining in the upper part of the tray is removed by the air. At least two vacuum suction parts are formed in both sides of the air sprayer. The vacuum suction vacuum-inhales the epoxy molding compound removed by the air.
申请公布号 KR20090019249(A) 申请公布日期 2009.02.25
申请号 KR20070083541 申请日期 2007.08.20
申请人 SECRON CO., LTD. 发明人 KIM, SUN OH
分类号 H01L21/02 主分类号 H01L21/02
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