发明名称 |
BULK METALLIC GLASS SOLDERS, FOAMED BULK METALLIC GLASS SOLDERS, FOAMED-SOLDER BOND PADS IN CHIP PACKAGES, METHODS OF ASSEMBLING SAME AND SYSTEMS CONTAINING SAME |
摘要 |
A foamed bulk metallic glass electrical connection is formed on a substrate of an integrated circuit package. The foamed bulk metallic glass electrical connection exhibits a low modulus that resists cracking during shock and dynamic loading. The foamed bulk metallic glass electrical connection is used as a solder bump for communication between an integrated circuit device and external structures. A process of forming the foamed bulk metallic glass electrical connection includes mixing bulk metallic glass with a blowing agent. |
申请公布号 |
KR20090019852(A) |
申请公布日期 |
2009.02.25 |
申请号 |
KR20087031046 |
申请日期 |
2007.06.12 |
申请人 |
INTEL CORP. |
发明人 |
MIN YONGKI;SUH, DAE WOONG |
分类号 |
H01L21/60 |
主分类号 |
H01L21/60 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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