发明名称 |
Method of manufacturing a chip |
摘要 |
Provided are a chip, a chip stack, and a method of manufacturing the same. A plurality of chips which each include: at least one pad formed on a wafer; and a metal layer which protrudes up to a predetermined thickness from the bottom of the wafer and is formed in a via hole exposing the bottom of the pad are stacked such that the pad and the metal layer of adjacent chips are bonded. This leads to a simplified manufacturing process, high chip performance and a small footprint for a chip stack. |
申请公布号 |
US7494909(B2) |
申请公布日期 |
2009.02.24 |
申请号 |
US20060499116 |
申请日期 |
2006.08.03 |
申请人 |
ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE |
发明人 |
JU CHULL WON;MIN BYOUNG GUE;KIM SEONG IL;LEE JONG MIN;LEE KYUNG HO;KANG YOUNG IL |
分类号 |
H01L21/00;H01L21/44;H01L21/46;H01L21/76;H01L23/02;H01L29/40 |
主分类号 |
H01L21/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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