| 发明名称 |
Method of reducing process steps in metal line protective structure formation |
| 摘要 |
A method of forming a protective structure on a top metal line on an interconnect structure is disclosed. The method includes providing a plate opening in the passivation layer on the top metal line and forming a protective plate in the plate opening on the top metal line.
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| 申请公布号 |
US7495335(B2) |
申请公布日期 |
2009.02.24 |
| 申请号 |
US20050131111 |
申请日期 |
2005.05.16 |
| 申请人 |
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. |
发明人 |
KUO I-LING |
| 分类号 |
H01L23/48 |
主分类号 |
H01L23/48 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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