| 摘要 |
A light emitting module includes a metal substrate, a bearing base, at least one LED, a printed circuit board, and at least one conductive wire. A first perforation is formed on the metal substrate and the bearing base is embedded into the first perforation of the metal substrate. According to an eutectic soldering method, the LED(s) is/are adhered on the bearing base by a compound metal. A second perforation is formed on the printed circuit board to expose the LED(s) which is/are adhered on the bearing base and further allows the printed circuit board to stick on the metal substrate. The conductive wires are used to connect electrically the LED(s) with the printed circuit board.
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